Why checking electronic components
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In 2020, Covid 19 hit the global economy with shaking the electronic industry by affecting its global supply chain. Due to many factories and electronic fab stopping operation, electronic components supply went to scarcity. Yet, many industries such as automotive, consumer, medical, defense and industrial were dependant of those components.
The grey market rapidly developped as it became the only way to get some components being able to supply industries so they could keep producing and avoiding collapsing.
Grey market involve risks. Indeed, there are many counterfeits and refurbished components circulating on the market. When buying on grey market is the only option, then you must limit risk by implementing quality control procedure on devices you may want to buy, and this particularly if you are paying for thoose goods before shipping them.
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Electronic components and counterfeit verification service range
Visual Inspection (Marking, Leads, Body, Device Size)
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This is a critical step in detecting counterfeit Integrated Circuits (ICs). This inspection focuses on several key physical attributes:
- Marking: Verifies that logos, serial numbers, and other markings are consistent with manufacturer specifications. Counterfeit ICs often have poorly printed or misaligned markings, incorrect fonts, or uneven ink quality.
- Leads: Inspects the condition of the IC’s leads (pins), looking for signs of oxidation, damage, or irregular shapes, which can indicate refurbishment or counterfeit production.
- Body: Examines the surface of the IC body for defects like scratches, dents, or mismatched textures, which may suggest tampering or rebranding.
- Device Size: Ensures that the dimensions of the device match the original specifications. Counterfeit components may have slight size deviations due to differences in manufacturing processes.
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Decapsulation Die Inspection (Visual Inspection of die and wafer markings)
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Decapsulation of an Integrated Circuit (IC) is a process used to remove the outer packaging of the chip, exposing the internal die for inspection. This is critical in verifying the authenticity of the IC and identifying counterfeit components.
By examining the die, inspectors can check for proper manufacturer markings, die layout, and overall quality, ensuring that the component matches the original manufacturer’s specifications.
Decapsulation helps detect fraudulent components that may otherwise appear legitimate externally but contain substandard or incorrect materials inside, preventing failures and ensuring product reliability.
X-ray & Die Inspection
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X-ray inspection of an Integrated Circuit (IC) is a non-invasive technique used to examine the internal structure of the component without damaging it.
This method allows inspectors to verify the integrity of the internal connections, bond wires, and die alignment, which are critical indicators of authenticity.
X-ray inspection can reveal irregularities such as missing or misaligned wires, variations in die size, or other internal defects that may suggest the IC is counterfeit.
By providing a clear view of the IC’s internal features, X-ray inspection helps ensure the component’s authenticity and functional reliability.
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Curve Trace Analysis
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Curve Trace Analysis is a method used to evaluate the electrical characteristics of an Integrated Circuit (IC) or semiconductor device. It involves applying varying voltages and currents to the device and plotting the resulting voltage-current (V-I) curves.
By comparing these curves to the known signature of a genuine component, any deviations can be detected, which may indicate a counterfeit, damaged, or substandard device. Curve Trace Analysis is a valuable tool in identifying counterfeit components and ensuring that the device operates within its intended electrical parameters.
X-Ray Fluorescence
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X-ray Fluorescence (XRF) is a non-destructive analytical technique used to determine the elemental composition of materials in an Integrated Circuit (IC). In the context of counterfeit detection, XRF is commonly applied to inspect the materials used in the leads, solder, and packaging of electronic components.
XRF works by exposing the component to X-rays, which cause the atoms in the material to emit characteristic fluorescent radiation. By analyzing this radiation, the exact composition of the material can be determined. This helps to:
- Identify impurities or incorrect materials that may suggest counterfeit or substandard production.
- Verify compliance with regulations such as RoHS (Restriction of Hazardous Substances), which limits the use of hazardous materials like lead or cadmium.
- Compare materials used in a component against manufacturer specifications to ensure authenticity.
XRF is highly useful in detecting counterfeit ICs by revealing inconsistencies in the materials used.
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